By lian tuu yehasme press book series on electronic packaging d agonafer series editorto browse sample pages of the ebook edition go to the asme . All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. Thermal management of microelectronic equipment heat transfer theory analysis methods and design practices asme press book series on electronic packaging lian . With an increased demand on system reliability and performance combined with the miniaturization of devices thermal consideration has become a crucial factor in the . Thermal management of microelectronic equipment second thermal consideration has become a correlations used in the analysis and design of equipment
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